Principal Hardware Design Lead

Principal Hardware Design Lead

£120,000 - £150,000 + Bonus + Benefits
South Coast | Hybrid Working

The better you become as an engineer, the less time you often spend engineering.

Technical leadership becomes programme leadership. Architecture becomes governance. Your experience is valued, but increasingly through reviews, approvals and project meetings rather than solving the problems yourself.

We're looking for a Principal Hardware Design Lead to provide technical and people leadership across the development of advanced communications technology.

The role combines architecture, team leadership, customer engagement and product delivery. You'll help shape technical direction, support key customer discussions and lead a team delivering complex FPGA and ASIC technology, whilst remaining closely involved in the engineering decisions that underpin the product.

The Opportunity

• Lead and develop a team delivering complex FPGA and ASIC technology.
• Define technical direction and influence long-term product strategy.
• Own the successful delivery of high-value engineering programmes.
• Work directly with customers, architects and senior stakeholders to turn ideas into products.

What We're Looking For

• A proven track record leading teams delivering complex digital hardware products.
• Strong FPGA and/or ASIC design expertise coupled with system-level architectural thinking.
• The ability to balance technical leadership, project delivery and people development.
• An engineer who enjoys mentoring others whilst remaining close to the technology.

Experience within communications, semiconductor IP, wireless infrastructure, signal processing or other technically demanding environments would be advantageous.

If you're at your best when solving technical problems, developing engineers and influencing product direction, this could be worth exploring further.Yoh Solutions Ltd (a Day & Zimmermann company) are electronic engineering recruitment specialists sourcing high-calibre permanent and interim engineering talent globally.