IC Packaging Design Engineer

Job Title: IC Packaging Design Engineer

Location: Chandler, AZ or Hillsboro, OR

Job Type: Onsite

Experience: Refer below

Employment: Long Term Contract

Summary

Tessolve is hiring 4 IC Packaging Design Engineers based in Chandler, AZ (primary) or Hillsboro, OR (secondary) . We're looking for senior-level talent (10+ years) primarily, with mid-level (4–6+ years MS / 6+ years BS) candidates also considered .

About the Role

As an IC Packaging Design Engineer, you'll work on physical design and layout of IC packages, driving substrate design and SI/PI-aware implementation for high-performance semiconductor products . You'll collaborate closely with cross-functional teams to ensure designs meet performance, manufacturability, yield, and reliability targets .

What You'll Do

• Perform physical design and layout of IC packages

• Execute substrate design and layout

• Implement SI/PI-aware design practices

• Design for performance, manufacturability, yield, and reliability (DFM/DFY/DFR)

• Ensure design rule compliance across all deliverables

• Use Siemens (Mentor) Xpedition (XPD) or Cadence Allegro/Advanced Package Designer (APD/SiP) for design execution

What You Bring

• Bachelor's or Master's degree in Electrical/Electronics Engineering

• Senior-level: ~10+ years in IC packaging / package design, OR

• Mid-level: 4–6+ years (MS) or 6+ years (BS) in IC packaging / package design

• Strong hands-on experience in Siemens Xpedition (XPD) or Cadence Allegro/APD (SiP)

• Proven experience in substrate design, SI/PI-aware implementation, and design rule compliance

What We Offer

• Engagement with a leading semiconductor engineering firm

• Opportunity to work on cutting-edge IC packaging projects

• Flexible location options: Chandler, AZ or Hillsboro, OR

About Us

Tessolve Semiconductors, a venture of Hero Electronix, is a Design and Test Engineering Service Company providing End to End Solutions from Product Engineering, Software, Hardware, Wireless, Automotive and Embedded Solutions . Tessolve offers a unique combination of pre-silicon and post-silicon exper tise to provide an efficient turnkey solution for silicon bring-up, spec to the product . With 2500+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs . Tessolve offers a Turnkey ASIC Solution, from design to pa ckaged parts . We have a global presence with office locations in the United States, India, Singapore, Malaysia, G ermany, United Kingdom, China, UK, Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose . Tessolve offers a highly competitive compensation and benefits along with an electric work environment to scale one’s intellect, skills and growth .