IC Packaging Design Engineer

IC Packaging Design Engineer

LOC: Chandler, AZ or Hillsboro, OR (ONSITE)

Longterm Contract – 1 Year +

No openings : 4

Skills Required

Bachelor’s or Master’s degree in Electrical /Electronics Engineering

Experience Tier: Senior-level (primary); Mid-level (secondary)

• Senior-Level: ~10+ years in IC packaging / package design

• Mid-Level: 4–6+ years (MS) or 6+ years (BS) in IC packaging / package design

Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)

Experience:

Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)

Candidates should have experience in the below domains:

•  Physical Design & Layout

•  Substrate design and layout

•  SI/PI aware design implementation

•  Design for performance, manufacturability, yield, and reliability

•  Design rule compliance


Thanks :