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Principal PCB Designer- Digital Design

Meridianservices LLC.Santa Clara, CA🇺🇸United States

Why this role stands out

As a Principal Hardware Engineer, you'll drive innovation in challenging power system designs for extreme environments, offering significant career growth and skill development. This hybrid role is ideal for experienced leaders who thrive on complex technical challenges and enjoy collaborating within a reputable company. Apply now to shape the future of cutting-edge technology!

Quick overview

SeniorityLeader
Work modeHybrid
LocationSanta Clara, CA, United States
System Design

Job description

Role:

  • Design, develop, and troubleshoot high speed digital systems and power subsystems for use in extreme environments.
  • Architect power distribution networks (PDN) for multi-rail, high-current telecom platforms such as base station hardware
  • Design and specify DC-DC converters, LDOs, PoL regulators, and sequencing/supervisory circuits
  • Define power budgets, thermal dissipation estimates, and efficiency targets
  • Support product development through hands-on board level prototyping, testing and troubleshooting.
  • Participate in board and system-level bring-up, debug and qualification, with a heavy emphasis on product characterization and design verification.
  • Perform PDN analysis including impedance profiling, decoupling strategy, and transient response modeling

Requirements:

  • BS or MS in Electrical Engineering
  • Expertise in high-speed digital design & verification
  • Expertise in the design, test and analysis of Power Distribution Networks
  • Experience with high speed serial interfaces (10Gb/s and above)
  • Experience with high speed memory design (e.g. DDR3, DDR4, DDR5)
  • At least 7 years of experience in digital system design including a solid understanding of:
    • Clock distribution
    • Power generation and distribution
    • Signal termination techniques
    • EMI control and reduction
    • Thermal considerations
  • Mastery of board layout techniques, including stackup design, material selection, impedance control, EMI considerations, etc.

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