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IC Packaging Design Engineer

Comprehensive Resources Inc.Hillsboro, OR🇺🇸United StatesPosted 2 Sept 2026

Why This Role Stands Out

This role at Comprehensive Resources Inc. offers you the chance to shape the future of IC packaging with a focus on cutting-edge design and advanced technologies. You'll thrive here if you possess strong hands-on experience with Siemens Xpedition or Cadence Allegro, and are driven to innovate in physical design and layout. Apply now to join a leading company and advance your career in a dynamic engineering environment.

Quick Overview

Seniority
Mid Senior
Work mode
On Site
Location
Hillsboro, OR, United States
Posted
1 week ago

Job Description

Role : IC Packaging Design Engineer

LOC: Chandler, AZ or Hillsboro, OR (ONSITE)

Experience : !0+ years



Skills Required : -


Bachelor s or Master s degree in Electrical /Electronics Engineering

Experience Tier: Senior-level (primary); Mid-level (secondary)

Senior-Level: ~10+ years in IC packaging / package design

Mid-Level: 4-6+ years (MS) or 6+ years (BS) in IC packaging / package design

Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)


Experience :-



Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)


Candidates should have experience in the below domains:

Physical Design & Layout

Substrate design and layout

SI/PI aware design implementation

Design for performance, manufacturability, yield, and reliability

Design rule compliance

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