Process Development Engineer - SMT/PCB Assembly/Packaging

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit to learn how our innovative team is helping connect, protect and power our planet.

RESPONSIBILITIES:

• Develop and optimize SMT, semiconductor packaging, and advanced assembly processes.
• Support both volume production as well as New Product Introduction (NPI) production.
• Support manufacturing for surface mount electronics (SMT), Flip Chip Attach and Die Attach.
• Lead process characterization, DOE execution, and process window development
• Evaluate new equipment, processes, and materials.
• Generating post build/DFM report.
• Take 5S/process improvement initiatives.
• Monitor Product Yields daily and work with appropriate engineers to take corrective actions.
• Work with Fixturing vendors to design and support assembly in the factory.
• Mentor technicians and operators on process control and best practices.
• Develop process documentation, work instructions, control plans, and manufacturing standards.

QUALIFICATIONS:

• BS in Mechanical, Electrical, Manufacturing, Material engineering degree or related discipline; MS degree preferred.
• 2+ years industry experience required or postgraduate degree accepted in lieu of industry experience
• Relevant industry internship experience desired.
• Strong Semiconductor Assembly experience with High density of fine pitch components - BGA, LGA, QFN, 0201, 01005 components, etc
• 1-2 years of experience in a mid to high-volume manufacturing environment preferred
• Experience with reflow, pick and place and solder paste printing is preferred
• Experience with SPC techniques and Lean practices is preferred
• Knowledge of IPC-A-610 standard preferred

DESIRED SKILLS:

• Strong technical leadership
• Excellent communication skills
• Project management capability
• Cross-functional collaboration
• Continuous improvement mindset

This position is not eligible for visa sponsorship by the Company.

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MAKE A DIFFERENCE AT QORVO

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets - we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.

Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.