IC Packaging Design Engineer

IC Packaging Design Engineer
LOC: Chandler, AZ or Hillsboro, OR (ONSITE)
Longterm Contract – 1 Year +
Experience: 10+ years 
 
Skills Required
 
Bachelor’s or Master’s degree in Electrical /Electronics Engineering
Experience Tier: Senior-level (primary); Mid-level (secondary)
• Senior-Level: ~10+ years in IC packaging / package design
• Mid-Level: 4–6+ years (MS) or 6+ years (BS) in IC packaging / package design
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
 
Experience:
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
 
Candidates should have experience in the below domains:
•  Physical Design & Layout
•  Substrate design and layout
•  SI/PI aware design implementation
•  Design for performance, manufacturability, yield, and reliability
•  Design rule compliance

📧
📞 +1 Ext. 106