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Product Engineer

TESSOLVE SEMICONDUCTOR PRIVATE LIMITEDAustin, TX🇺🇸United StatesPosted Sep 30, 2026

Quick Overview

Seniority
Mid Senior
Work mode
Hybrid
Location
Austin, TX, United States
Posted
Yesterday
Root Cause Analysis

Job Description

Summary

We're looking for a Principal Product Engineer to own the end-to-end lifecycle of Ethernet and Data Center products within our Networking & Connectivity team. This is a technical leadership role for someone who thrives on owning products from NPI through yield ramp, driving cost and quality improvements, and aligning cross-functional teams around strategic product initiatives.

About Tessolve

What You'll Do

  • Own new product introduction (NPI) deliverables including product characterization, test operation, qualification, yield ramp, and manufacturability
  • Propose and execute product cost and quality improvement initiatives
  • Partner with design, DFT/DFM, process, package, and test teams to optimize product performance, quality, and cost across multiple test insertions (Wafer Sort, Final Test, SLT)
  • Align cross-functional engineering teams to full-closure solutions
  • Plan and drive strategic initiatives to enhance new product development methodology
  • Prepare and present summaries for regular updates with cross-functional and executive teams

What You Bring

  • Bachelor's degree in Computer Science, Electrical Engineering, or related field with 10+ years of related experience, OR Master's/PhD with 5+ years of experience
  • Deep understanding of end-to-end product lifecycle and strategic cost management
  • Hands-on experience with ATE platforms (e.g., Advantest 93K, Teradyne) and System Level Test (SLT) for silicon debug, root cause analysis, and corrective actions
  • Solid foundation in applied statistics for product characterization and quality improvement
  • Familiarity with data analytics tools such as JMP and SiliconDash
  • Strong schedule management and optimization skills (interest in process automation a plus)
  • Solid background in test methodology, silicon process, package, and DFT/DFM
  • Ability to lead cross-functional initiatives, work independently, and manage complex problem-solving
  • Strong skill in transforming complex data analytics into high-level presentations

What We Offer

  • Opportunity to be a technical leader on cutting-edge Ethernet and Data Center silicon products
  • Cross-functional exposure across design, process, package, and test engineering
  • A collaborative, innovation-driven engineering culture
  • Competitive compensation and growth opportunities

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