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ASIC Physical Design Engineer

SolGenie Technologies, INCLafayette, IN🇺🇸United StatesPosted 20 Aug 2026

Why This Role Stands Out

Advance your ASIC physical design career with a leading semiconductor client, leveraging your TSMC FinFET expertise in a hybrid environment that offers significant growth and customer interaction. This role is ideal for mid-senior engineers who thrive on technical challenges and impactful contributions to cutting-edge semiconductor projects. Apply today to join a dynamic team and shape the future of technology!

Quick Overview

Seniority
Mid Senior
Work mode
Hybrid
Location
Lafayette, IN, United States
Posted
6 days ago

Job Description

We’re hiring for a full-time opportunity with a leading semiconductor end client in Lafayette, IN. 
Seeking experienced ASIC Physical Design / Backend Engineers with strong TSMC FinFET tapeout and signoff experience.. Detailed job description is given below.
 
Title: ASIC Physical Design Engineer (TSMC / FinFET)
Location: Lafayette, Indiana (“Relocation assistance provided”)
Type: Full time with Client
  • Tapeout , Signoff , DRC/LVS/PEX, Customer interaction
Job Responsibilities:
  • Act as the primary interface between customers and semiconductor foundries to ensure successful tape-outs
  • Guide customers through design sign-off, including sharing required documentation and technical requirements
  • Collaborate with internal design, layout, and engineering teams to ensure manufacturability
  • Prepare, review, and validate designs for fabrication using EDA tools
  • Support customer engagements by providing technical expertise during pre-sales and project execution
  • Partner with customers throughout the chip design and manufacturing lifecycle to ensure a smooth experience
  • Coordinate with foundry partners (primarily TSMC) on specifications, timelines, and fabrication requirements
  • Track project milestones and drive on-time delivery
  • Maintain accurate documentation of project status, customer communication, and technical details
  • Identify and implement process improvements and automation opportunities

Must-Have Skills & Experience:

  • Proven tape-out experience with advanced TSMC nodes (e.g., FinFET technologies)
  • Strong understanding of semiconductor backend processes
  • Experience working directly with customers and external partners
  • Excellent communication skills (written and verbal)
  • Ability to manage multiple priorities and solve complex technical issues
  • Proactive, detail-oriented, and team-oriented mindset
  • Familiarity with Linux environments
  • Basic scripting or programming experience

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