Engineering

IC Packaging Design Engineer

Goldenpick Technologies LLCBeaverton, OR🇺🇸United StatesPosted Oct 15, 2026

Why This Role Stands Out

This role at Goldenpick Technologies LLC offers a fantastic opportunity to drive cutting-edge IC packaging designs and contribute to high-performance semiconductor products, fostering significant career growth. You'll thrive here if you're a mid-senior engineer passionate about physical design and collaborating within a dynamic team to achieve ambitious targets. Apply now to shape the future of semiconductor technology!

Quick Overview

Seniority

Mid Senior

Work mode

On Site

Location

Beaverton, OR, United States

Posted

Yesterday

Job Description

Title: IC Packaging Design Engineer

Location: Chandler, AZ or Hillsboro,OR

Job type: Onsite

About the Role

As an IC Packaging Design Engineer, you'll work on physical design and layout of IC packages, driving substrate design and SI/PI-aware implementation for high-performance semiconductor products. You'll collaborate closely with cross-functional teams to ensure designs meet performance, manufacturability, yield, and reliability targets.

What You'll Do

Perform physical design and layout of IC packages
Execute substrate design and layout
Implement SI/PI-aware design practices
Design for performance, manufacturability, yield, and reliability (DFM/DFY/DFR)
Ensure design rule compliance across all deliverables
Use Siemens (Mentor) Xpedition (XPD) or Cadence Allegro/Advanced Package Designer (APD/SiP) for design execution

What You Bring

Bachelor's or Master's degree in Electrical/Electronics Engineering
Senior-level: ~10+ years in IC packaging / package design, OR
Mid-level: 4–6+ years (MS) or 6+ years (BS) in IC packaging / package design
Strong hands-on experience in Siemens Xpedition (XPD) or Cadence Allegro/APD (SiP)
Proven experience in substrate design, SI/PI-aware implementation, and design rule compliance