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Physical Design Engineer (Back-Fill Role)

Metalight Solutions IncMountain View, CA🇺🇸United StatesPosted 9 Sept 2026

Why This Role Stands Out

This role offers a fantastic opportunity to deepen your expertise in advanced-node SoC physical design, driving impactful projects from netlist to GDSII with competitive hourly compensation. You'll thrive here if you have 5-10 years of experience in high-performance, low-power design and a passion for tackling complex physical implementation challenges. Don't miss out on the chance to contribute to cutting-edge technology and advance your career!

Quick Overview

Salary
$60 - $65/hr
Seniority
Mid Senior
Work mode
On Site
Location
Mountain View, CA, United States
Posted
Yesterday
CAD

Job Description

Job Title: Physical Design Engineer
Location: Mountain View, CA Onsite
Rate: $60-$65/hr. on W2
Openings: 2
Experience: 5 10 Years

Job Overview

We are looking for an experienced Physical Design Engineer with strong hands-on experience in advanced-node SoC physical design, particularly TSMC 3nm/2nm technologies.

The ideal candidate will have experience working on high-performance, low-power SoC/GPU designs and should be capable of owning the physical implementation flow from netlist through GDSII/tapeout.

Key Responsibilities

  • Own and execute the complete Netlist-to-GDSII physical design flow for high-performance, low-power SoCs.
  • Perform floorplanning, power planning, placement, Clock Tree Synthesis (CTS), routing, and physical optimization.
  • Drive timing closure and resolve setup/hold, congestion, DRC and routing-related issues.
  • Optimize designs for Power, Performance, and Area (PPA) at advanced process nodes.
  • Work on advanced-node challenges including:
    • IR Drop
    • Electromigration (EM)
    • Crosstalk / Signal Integrity
    • Congestion
    • Timing violations
    • Design Rule violations
  • Perform block-level and/or SoC-level physical implementation and optimization.
  • Analyze timing and physical design reports and implement appropriate fixes/ECOs.
  • Work closely with RTL, STA, DFT, architecture, CAD and verification teams to achieve physical design closure.
  • Support physical verification and final signoff activities.
  • Contribute to achieving aggressive performance, power, area and tapeout goals.

Required Technical Skills

  • 5 10 years of hands-on Physical Design / ASIC / SoC experience.
  • Strong experience with Netlist-to-GDSII / RTL-to-GDSII physical design flow.
  • Hands-on experience with Cadence Innovus is highly important.
  • Experience with one or more advanced process nodes:
    • 2nm
    • 3nm
    • 4nm
    • 5nm
  • Strong experience in:
    • Floorplanning
    • Placement
    • CTS
    • Routing
    • Timing Closure
    • PPA Optimization
    • Physical Design Closure
  • Experience with Synopsys Fusion Compiler.
  • Strong experience with Synopsys PrimeTime / STA.
  • Experience with Calibre for physical verification/signoff.
  • Experience dealing with IR Drop, EM, Crosstalk and Signal Integrity issues.
  • Experience with high-performance SoC/GPU/ASIC designs is strongly preferred.

Preferred Experience

  • Direct experience with TSMC 3nm or 2nm technology.
  • Experience with GPU, CPU, AI accelerator, HPC or other high-performance SoCs.
  • Proven advanced-node tapeout experience.
  • Experience driving aggressive PPA targets.
  • Experience with timing ECOs and physical ECOs.
  • Strong understanding of advanced-node physical design challenges.

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