Windows Power and Thermal Hardware Engineer

Qualcomm seeks a Windows Power and Thermal Engineer to optimize power, performance, and thermals for next generation SoCs and AI driven devices. You will design and tune Windows power/thermal policies, develop tools and scripts, and analyze system level behavior across CPU, GPU, NPU, and RF subsystems. Collaborate with silicon, firmware, and OS teams to debug complex issues, run lab measurements, and validate features on reference and OEM hardware. Document findings, drive design recommendations, and help define best practices that improve battery life, device reliability, and user experience in global 5G and AI platforms.

Responsibilities

• Design and optimize Windows power and thermal management strategies for Qualcomm So
• Cs and platforms
• Analyze system level power, performance, and thermal data across CPU, GPU, NPU, and RF subsystems
• Develop tools, scripts, and workflows to profile and tune power/thermal behavior under real world workloads
• Collaborate with silicon, firmware, OS, and OEM partners to debug and resolve complex system issues
• Perform lab measurements, bring up, and validation on reference designs and customer devices
• Define and refine power/thermal policies to improve battery life, performance, and device reliability
• Document analysis, findings, and recommendations for internal stakeholders and external partners
• Support enablement of AI and 5
• G features with efficient power and thermal characteristics
• Contribute to architecture reviews and roadmap discussions for future platforms
• Drive best practices and guidelines for power and thermal optimization across product lines

Required Skills

• Windows power management
• Thermal profiling and modeling
• So
• C architecture (CPU/GPU/NPU)
• Embedded firmware interaction
• Performance and power benchmarking
• Scripting in Python or Power
• Shell
• Lab measurement and instrumentation
• ACPI and Windows driver frameworks
• Data analysis and visualization
• System level debugging