Why this role stands out
Advance your career at the cutting edge of semiconductor innovation by joining Metalight Solutions to master TSMC 2NP/3NP technology in a high-impact, collaborative environment. This role is perfect for a skilled engineer who thrives on solving complex physical design challenges and wants to contribute to the future of advanced ASIC development. Apply today to elevate your technical expertise and join a team pushing the boundaries of what is possible in silicon engineering.
Quick overview
Job description
Physical Design Engineer Semiconductor / ASIC
Location: Palo Alto, CA (100% Onsite)
Openings: 5
Job Overview
We are looking for an experienced Physical Design Engineer with strong hands-on expertise in end-to-end ASIC physical design and advanced semiconductor process nodes. The ideal candidate must have exposure to TSMC 2NP/3NP technology and proven experience in physical implementation, timing closure, power optimization, and physical verification.
Key Responsibilities
- Execute the complete physical design flow, including floorplanning, power planning, placement, clock tree synthesis (CTS), routing, and post-route optimization.
- Perform timing analysis and achieve timing closure across multiple operating modes and process, voltage, and temperature (PVT) corners.
- Debug and resolve timing, congestion, power, signal integrity, and design variability issues.
- Perform physical verification and resolve DRC, LVS, and ERC violations.
- Conduct static timing analysis (STA) using Synopsys PrimeTime and support timing signoff.
- Analyze signal integrity, crosstalk, IR drop, and electromigration (EM) issues.
- Implement low-power design techniques, including multi-Vt, multi-voltage designs using UPF, power gating, and clock gating.
- Work on advanced technology nodes, including 7nm, 5nm, 3nm, and below.
- Collaborate with RTL, microarchitecture, DFT, CAD, and foundry teams to resolve implementation and signoff challenges.
- Develop automation scripts and improve physical design methodologies and implementation flows.
Required Qualifications
- Mandatory exposure to TSMC 2NP/3NP process technology.
- Strong hands-on experience with the complete ASIC/SoC physical design flow.
- Experience with floorplanning, power planning, placement, CTS, routing, and post-route optimization.
- Proven experience in multi-mode, multi-corner timing closure.
- Strong understanding of STA, physical verification, signal integrity, IR drop, and EM analysis.
- Experience with low-power design methodologies, including UPF, multi-Vt, multi-voltage, power gating, and clock gating.
- Experience working on advanced semiconductor process nodes, preferably 7nm, 5nm, 3nm, or below.
- Experience using industry-standard physical design and signoff tools.
Preferred Skills
- Synopsys PrimeTime for STA and timing signoff.
- Physical design implementation tools such as Synopsys ICC2 or Fusion Compiler, or Cadence Innovus.
- Signoff and physical verification tools such as Calibre or comparable solutions.
- Scripting and automation using Tcl, Python, or Perl.
- Strong debugging, problem-solving, and cross-functional collaboration skills.
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