Back to Jobs
Engineering

Physical Design Engineer Semiconductor / ASIC

Metalight Solutions IncPalo Alto, CA🇺🇸United States

Why this role stands out

Advance your career at the cutting edge of semiconductor innovation by joining Metalight Solutions to master TSMC 2NP/3NP technology in a high-impact, collaborative environment. This role is perfect for a skilled engineer who thrives on solving complex physical design challenges and wants to contribute to the future of advanced ASIC development. Apply today to elevate your technical expertise and join a team pushing the boundaries of what is possible in silicon engineering.

Quick overview

SeniorityMid Senior
Work modeOn Site
LocationPalo Alto, CA, United States
CAD

Job description

Physical Design Engineer Semiconductor / ASIC
Location: Palo Alto, CA (100% Onsite)
Openings: 5

Job Overview

We are looking for an experienced Physical Design Engineer with strong hands-on expertise in end-to-end ASIC physical design and advanced semiconductor process nodes. The ideal candidate must have exposure to TSMC 2NP/3NP technology and proven experience in physical implementation, timing closure, power optimization, and physical verification.

Key Responsibilities

  • Execute the complete physical design flow, including floorplanning, power planning, placement, clock tree synthesis (CTS), routing, and post-route optimization.
  • Perform timing analysis and achieve timing closure across multiple operating modes and process, voltage, and temperature (PVT) corners.
  • Debug and resolve timing, congestion, power, signal integrity, and design variability issues.
  • Perform physical verification and resolve DRC, LVS, and ERC violations.
  • Conduct static timing analysis (STA) using Synopsys PrimeTime and support timing signoff.
  • Analyze signal integrity, crosstalk, IR drop, and electromigration (EM) issues.
  • Implement low-power design techniques, including multi-Vt, multi-voltage designs using UPF, power gating, and clock gating.
  • Work on advanced technology nodes, including 7nm, 5nm, 3nm, and below.
  • Collaborate with RTL, microarchitecture, DFT, CAD, and foundry teams to resolve implementation and signoff challenges.
  • Develop automation scripts and improve physical design methodologies and implementation flows.

Required Qualifications

  • Mandatory exposure to TSMC 2NP/3NP process technology.
  • Strong hands-on experience with the complete ASIC/SoC physical design flow.
  • Experience with floorplanning, power planning, placement, CTS, routing, and post-route optimization.
  • Proven experience in multi-mode, multi-corner timing closure.
  • Strong understanding of STA, physical verification, signal integrity, IR drop, and EM analysis.
  • Experience with low-power design methodologies, including UPF, multi-Vt, multi-voltage, power gating, and clock gating.
  • Experience working on advanced semiconductor process nodes, preferably 7nm, 5nm, 3nm, or below.
  • Experience using industry-standard physical design and signoff tools.

Preferred Skills

  • Synopsys PrimeTime for STA and timing signoff.
  • Physical design implementation tools such as Synopsys ICC2 or Fusion Compiler, or Cadence Innovus.
  • Signoff and physical verification tools such as Calibre or comparable solutions.
  • Scripting and automation using Tcl, Python, or Perl.
  • Strong debugging, problem-solving, and cross-functional collaboration skills.

Similar jobs