Full timeTechnology

PIC Process Integration Engineer

NokiaSunnyvale🇺🇸United States

Why this role stands out

You'll thrive in this role as a PIC Process Integration Engineer at Nokia, where you'll lead the critical bring-up and qualification of a new InP photonics fabrication facility, directly impacting the future of cutting-edge semiconductor manufacturing. This opportunity is perfect for experienced engineers with a passion for process development and yield improvement in a pioneering environment. Don't miss the chance to shape the future of photonic device fabrication and advance your career with a global leader.

Quick overview

SeniorityMid Senior

Employment typeFull Time

Work modeHybrid

LocationSunnyvale, United States

Continuous ImprovementDesign for ManufacturingPython

Job description

We are seeking a highly motivated and technically skilled engineer to lead the bring-up and qualification of a new Indium Phosphide (InP) photonics semiconductor fabrication facility. This role is critical to establishing high-yield, scalable, and reliable photonic device manufacturing processes in a cutting-edge fab environment. The ideal candidate will have experience with InP or compound semiconductor process development, fab tool qualification, and yield improvement.

Fab Bring-Up & Equipment Qualification: Support the start-up and drive the qualification of front-end and back-end process tools for InP-based photonic device fabrication. Work closely with process engineers and other internal stakeholders to meet process and equipment milestones.

Process Development & Integration: Develop and optimize process modules (etch, deposition, lithography, diffusion, metallization, etc.) for InP-based PICs (Photonic Integrated Circuits). Ensure process robustness and repeatability across the full device flow.

Yield & Reliability Engineering: Establish process monitoring metrics, inline metrology strategies, and SPC to drive yield improvement. Identify root causes of process excursions or device failures; lead corrective actions using FA tools and DOE methodology.

Cross-Functional Collaboration: Interface with device design, test, and packaging teams to ensure manufacturability and alignment on performance targets.

Documentation & Technology Transfer: Develop and maintain detailed process documentation, FMEA analyses, and qualification reports. Support the transfer of developed processes from R&D to pilot and volume production.

BS/MS/PhD in Electrical Engineering, Materials Science, or related field.
Hands-on experience in compound semiconductor fabrication, with a strong preference for InP-based photonics.
Understanding of semiconductor process integration, yield improvement methodologies, and cleanroom practices.
Experience with fab tool bring-up and qualification, including troubleshooting and maintenance support.
Strong problem-solving skills, with a data-driven mindset and familiarity with tools like JMP, Python and MES/SPC software packages.
Experience with SPC, Design for Manufacturing (DfM), and six-sigma principles for continuous improvement is a plus.
Excellent communication and teamwork skills; able to work in a fast-paced startup or ramp-up environment.

What We Offer

A chance to contribute to cutting-edge photonic technologies in a globally recognized company.
A collaborative, innovative work environment with multidisciplinary technical teams.
The opportunity to directly impact the development of high-performance optical networking solutions at Nokia.

If you're passionate about advancing optical communication technology and eager to tackle challenging technical problems in PIC development, we invite you to apply.