Failure Analysis Engineer(in-person needed)

Position Summary
The Failure Analysis Engineer (FAE) is responsible for investigating, analyzing, and identifying root causes of

failures in electronic assemblies, systems, and components used in high-performance computing, server, and AI-
related hardware products. This role supports continuous improvement and product reliability initiatives

through data-driven analysis, cross-functional collaboration, and corrective action implementation. The FAE will
leverage advanced diagnostic tools and methods to enhance product quality, manufacturing yields, and
customer satisfaction

Supervisory Responsibilities
May oversee FA Technicians and provide technical guidance and training.
Coordinates project assignments and ensures timely completion of analysis reports.
Key Responsibilities
Failure Analysis and Root Cause Investigation (50%)
Perform electrical, mechanical, and thermal failure analysis on defective units from production, field
returns (RMA), and reliability testing.
Utilize analytical tools such as oscilloscopes, X-ray, SEM/EDS, decapsulation, and cross-sectioning for
detailed investigation.
Identify failure modes, document analysis results, and establish root cause and contributing factors.
Correlate failures with design, process, and material data to support engineering improvements.
Data Collection and Reporting (20%)
Maintain detailed FA reports, including findings, corrective actions, and risk assessments.
Present analysis summaries to internal engineering, manufacturing, and customer teams.
Compile trend data on recurring failure modes and propose mitigation actions.
Track metrics on failure rates, mean time between failure (MTBF), and reliability indicators.

JOB DESCRIPTION
Cross-Functional Collaboration (15%)
Partner with manufacturing, R&D, and quality engineering teams to drive corrective and preventive
actions (CAPA).
Support supplier quality teams in component failure validation and incoming inspection processes.
Coordinate with customer support and warranty analysis teams on field failure investigations.
Process and Product Improvement (10%)
Participate in Design for Manufacturability (DFM) and Design for Reliability (DfR) reviews.
Recommend design or process modifications to reduce defect rates and improve overall product
robustness.
Contribute to process control documentation and standard operating procedures (SOPs).
Compliance and Safety (5%)
Ensure all FA activities comply with ESD, ISO, and environmental standards (e.g., RoHS, REACH).
Maintain lab equipment calibration and safe operating practices.

Education:
Bachelor s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field
required.
Master s degree or equivalent experience in Reliability Engineering, Failure Analysis, or Quality
Engineering preferred.

Experience:
3 5 years of experience in failure analysis or reliability engineering within electronics, semiconductor,
or high-tech manufacturing industries.
Experience with AI server systems, GPU boards, or data center hardware is a plus.
Technical Skills:
Proficiency with diagnostic equipment (oscilloscope, DMM, logic analyzer, X-ray, SEM, FIB, etc.)
Knowledge of SMT manufacturing, solder joint analysis, and IPC standards.
Familiarity with reliability testing (HALT, HASS, thermal cycling, vibration testing).
Experience with data analysis tools (Python, JMP, Minitab, Excel).
Ability to interpret schematics, layout drawings, and bill of materials (BOM).
Core Competencies
Analytical Thinking: Strong ability to dissect complex problems and identify root causes.
Technical Expertise: Deep understanding of electrical/electronic systems, PCB design, and
semiconductor behavior.
Collaboration: Works effectively with multidisciplinary teams to solve technical challenges.
Communication: Ability to write clear, data-supported reports and present findings to technical and
non-technical audiences.
Continuous Improvement: Passion for enhancing product reliability and manufacturing efficiency
Performance Indicators (KPI s)
Failure Analysis Turnaround Time (TAT)
Root Cause Accuracy and Verification Rate
Corrective Action Implementation Effectiveness
Reduction in Recurrence Rate of Failures
Customer Satisfaction (internal/external) with FA deliverables
Working Conditions
On-site role at Wistron s Alliance, TX manufacturing facility.
Exposure to electronics lab environments (ESD-safe areas, microscopes, soldering stations).
Occasional travel to suppliers, customer sites, or corporate headquarters (domestic/international).
Normal working hours with flexibility to support urgent FA cases and project deadlines.