Quick overview
Job description
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Experience in advanced silicon packaging, multichip module and high-speed interposer designs as well as solid understanding of assembly process.Mechanical, thermal and FEA modeling and design experience.
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Proven track-record of product development, from concept through volume production.
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Ability to work effectively in cross-disciplinary teams and drive technical collaborations.
- Excellent analytical and problem-solving skills.
- Master’s degree or higher in Mechanical Engineering, Materials Science, or related field.
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