Sr Mechanical Design Engineer

Client’s mechanical engineering team develops high-bandwidth switching hardware for hyperscale AI data centers, connecting the compute clusters used for AI training and inference. In this agency-employed contract assignment supporting Client, you will design chassis, card assemblies, and mechanical interfaces that integrate dense electronics into complete networking systems for AI infrastructure.

You will work with PCB, electrical, thermal, and manufacturing engineers to turn product requirements into physical assemblies that can be built, tested, and produced. The work combines detailed part design with system integration, including board placement, cooling interfaces, and supplier collaboration to resolve fabrication and assembly constraints. You will own assigned mechanical designs and follow them from CAD models to validated prototypes and manufacturable hardware, contributing engineering decisions within the product architecture and documenting how your designs meet requirements.

Minimum Requirements:

• Bachelor’s degree in Mechanical Engineering or a related engineering field, or equivalent practical experience, plus 7+ years of mechanical design experience with electronic or electromechanical hardware.

• Experience independently owning mechanical designs from concept through prototyping, validation, and production, including resolving interface and assembly issues with electrical, PCB, manufacturing, or supplier teams.

• Proficiency in 3D mechanical CAD for developing part and assembly models that communicate component geometry and mechanical interfaces.

• Experience designing sheet-metal parts and assemblies for electronic hardware, considering fabrication and assembly constraints.

• Experience creating production drawings using GD&T and performing tolerance and stack-up analyses for mechanical assemblies.

Desired Skills:

1. Proficiency in Creo or Siemens NX.

2. Experience with semiconductor packaging, high-density ASIC/PCB integration, or high-speed electrical or optical interconnects.

3. Experience designing plastic, machined, or die-cast components, or developing manufacturing fixtures and test hardware.

4. Experience designing networking, server, high-performance computing, or data-center hardware.

5. Experience in one or more supporting areas: liquid-cooling integration, electronics thermal management, or structural analysis using finite element analysis (FEA).