Quick Overview
Job Description
Are you ready to make a significant impact in a fast-paced, innovative environment?
We are seeking a Staff Package Design Engineer to join our dynamic team in Austin, TX. In this role, you’ll work closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire-bond QFN to advanced WLCSP and flip-chip designs.
This is a challenging design/layout position in a high volume, dynamic and fast paced environment, and will have a direct impact on business with external customers by helping create innovation that rocks. Products include top of the line Amps, Codecs and DSPs to name a few. The package design types are a wide variety from WLCSP to wirebond to flip chip. This is a chance to be part of a package design team supporting challenging customer expectations and a growing business.
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