Senior Firmware Engineer / FitnessTech

A rapidly growing consumer hardware and AI company is seeking a Senior Firmware Engineer, Connectivity, to join their full-time engineering team. This role can be based in the United States and focuses on building next-generation connected devices that blend embedded systems, cloud technology, and machine learning. The ideal candidate will bring deep expertise in Bluetooth Low Energy (BLE), embedded development in C/C++, and wireless device architecture while helping scale a globally deployed product platform.
This is a unique opportunity to become the primary technical owner of wireless connectivity for a category-defining consumer product. The engineer joining this team will influence architecture decisions, firmware update strategy, power optimization efforts, manufacturing validation, and customer-facing reliability initiatives. Candidates who enjoy solving difficult challenges across firmware, RF, hardware, and mobile environments will find significant growth opportunities and ownership in this position.
Required Skills & Experience

• 5+ years of embedded software or firmware engineering experience
• 3+ years building and shipping BLE-enabled products
• Strong understanding of Bluetooth protocols including GAP, GATT, L2CAP, SMP, and BLE security
• Expertise with C and/or C++ development on microcontrollers
• Experience with embedded peripherals including UART, SPI, I2C, and DMA
• Hands-on debugging experience using oscilloscopes, logic analyzers, and protocol sniffers
• Experience deploying OTA firmware updates in production environments
• Knowledge of low-power device optimization techniques

Desired Skills & Experience

• Nordic Semiconductor platform experience
• Zephyr or nRF Connect SDK experience
• Consumer electronics or IoT product experience
• Secure boot and embedded security knowledge
• Regulatory certification experience (FCC, CE, Bluetooth SIG)
• Manufacturing support experience
• Python or Node.js tooling experience
• Multi-device BLE architecture expertise

What You Will Be Doing
Tech Breakdown

• 70% Embedded Firmware Development
• 20% Wireless Connectivity & RF Optimization
• 10% Automation, Tooling & Testing

Daily Responsibilities

• 80% Hands-On Engineering
• 5% Leadership & Mentorship
• 15% Cross-Functional Collaboration

The Offer

• Bonus eligible

You will receive the following benefits:

• Medical, Dental, and Vision Insurance
• Vacation Time
• Stock Options

Applicants must be currently authorized to work in the US on a full-time basis now and in the future.
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