Principal Technologist

Job Responsibilities

• Lead advanced packaging technology engagement for key customer new products/applications penetration.
• To maintain sustain application position with customer R&D and HVM teams (Ensure HVM feedback is accounted for in future defense of process wins).
• Drive module process and equipment fundamental improvements to ensure we meet customer needs and win applications.
• Define overall NPI program schedules, align on, and drive required execution plans and program deliverables to completion while meeting critical milestones (customer’s roadmap)
• Proactively identify talent and continuously develop team members with a deliberate roadmap.
• Develop metrics to measure NPI program performance and to drive improvement through successive product introduction.
• Build strong cross-functional and matrixed relationships and collaborate with Product Marketing, Product Development, Service Engineering, and others to ensure a positive customer experience.

Education & Experience:

• Materials Science, Electrical Engineering, Chemical Engineering, Physics, or related field.
• 15+ years(bachelor) or 12+years(M.S./Dr.) of experience in the semiconductor field, especially in Thin Film/PECVD/LPCVD/ALD module process development. Tool vendor experience is plus.
• Strong project management and analytical skills.
• Proven success in building collaborative partnerships with customers and internal organizations.
• Effective English oral and written communication skills.
• Strong leadership qualities to exercise influence both throughout the organization and with BU/Service Team.
• Goal and customer oriented.
• Positive and energetic attitude with strong work ethic and initiative.