Why this role stands out
This remote Photonics Packaging Engineer role at Volantis Semiconductor offers a unique opportunity to own critical aspects of advanced photonics packaging, providing significant career growth and skill development at the intersection of photonics and IC assembly. You'll thrive here if you have experience with multi-die photonics and IC assemblies, and are eager to contribute to innovative projects within a reputable company. Apply today to join a dynamic team and advance your expertise in this exciting field.
Quick overview
Job description
What We're Looking For:
We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages.
This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team.
Ideal Background:
- Experience with integrated photonics package assemblies with multiple dies
- Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors
- Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc.
Nice to Have:
- Experience with large device count photonic assemblies
- Experience with clear underfill
- Experience with high density fiber attach
- Experience with large substrate size photonic MCM assemblies
- Hands-on experience with PIC design
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