Why This Role Stands Out
This on-site Senior Radio Frequency Engineer role offers a fantastic opportunity to lead critical redesigns and drive innovation in high-power amplifier development, ideal for an experienced engineer eager to mentor others and contribute to impactful projects. You will thrive here if you possess a strong background in RF power amplifier design and a passion for rigorous engineering, requirements management, and stakeholder engagement. Apply now to be part of a team shaping cutting-edge technology.
Quick Overview
Job Description
- Lead High Power Amplifier Circuit Card Assembly redesign to achieve strict Form‑Fit‑Function‑Interface compatibility
- Plan and execute measurements of GFP/GFI hardware; derive and verify baseline parameters (gain/flatness, impedance/VSWR, output power, spectral purity, pulse shape/timing)
- Develop correlated RF and thermal simulation models; evaluate device topologies (BJT/LDMOS/GaN) and output combining networks
- Author and maintain requirements in MBSE; produce SSS and ICS with full traceability to sources and verification methods
- Own EMI/EMC and environmental planning; define fixtures and pre‑qualification per applicable standards
- Prepare and lead SRR/PDR with Government stakeholders; capture minutes, actions, and update RAID log
- Coordinate U.S. vendor market survey; manage NDAs; integrate supplier inputs on risks, manufacturability, and prototype ROM
- Collaborate with program management to maintain PMP and IMS; report status, risks, and mitigations
- Mentor team members; uphold engineering rigor and documentation quality
- Other duties as assigned
This position is contingent upon contract award.
Education/Training:
- Bachelor’s Degree in relevant engineering or science discipline required
- Master’s degree preferred
Experience:
- 8+ years experience designing, testing, and qualifying RF power amplifiers for radar or high‑power pulsed applications (L‑band preferred)
- Hands‑on experience with BJT/LDMOS/GaN device selection, biasing, matching networks, and microstrip layout
- Proficiency building high‑fidelity RF and thermal models (e.g., Ansys HFSS/Icepak) and correlating to measured data
- Requirements engineering using MBSE tools (e.g., Cameo)
- Authoring System/Subsystem Specifications and Interface Control Specifications
- EMI/EMC planning and pre‑qualification per MIL‑STD‑461; environmental and ESS testing per MIL‑STD‑810
Security:
- Must be a US citizen
- If selected candidate does not have an active Clearance at level Secret or higher, one will be obtained upon hire
Physical Requirements:
- Able to occasionally reach with hands and arms
- Prolonged periods of computer screen use, while sitting or standing at a desk
- Adhere to safety protocols when in work areas requiring use of PPE (e.g. eyewear, gloves, masks, hearing protection, steel toed shoes, etc.)
- Able to safely lift and carry up to 20 pounds at a time
- Health Care Plan (Medical, Dental & Vision)
- Retirement Plan (401k, IRA)
- Life Insurance (Basic, Voluntary & AD&D)
- Paid Time Off (Vacation, Sick & Public Holidays)
- Short Term & Long Term Disability
- Training & Development
- Wellness Resources
Salary: $135,000 - $150,000
Salary rates for this position are competitive and commensurate with experience and industry standards. We offer a comprehensive benefits package that may include health insurance, paid time off, and retirement savings options.
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