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Engrg Technician 3

NokiaSunnyvale🇺🇸United States

Why this role stands out

Advance your career at a global innovation leader like Nokia, where you will gain hands-on expertise in cutting-edge optical integrated circuit manufacturing and assembly processes. This role is perfect for a proactive, technical professional who thrives in a collaborative environment and is eager to contribute to the development of next-generation technology. Apply today to sharpen your engineering skills and become a vital part of a world-class manufacturing team.

Quick overview

SeniorityMid Senior
Employment typeFull Time
Work modeOn Site
LocationSunnyvale, United States
Assembly

Job description

Job Family Description

Brief Description

Assembly Engineering Technician responsible for supporting Assembly Engineering team in development assembly builds and sustaining processes and tools in a 24x7 manufacturing & development facility specializing in optical integrated circuits.  Job will focus on weekend work days/hours but additional off-hours and weekday support may be required to sustain the 24x7 nature of the tools/processes owned.

Description

Responsibilities will include engineering support in sustaining and monitoring performance of  die singulation, die attach, wirebond and inspection tools and/or process steps in the fabrication of monolithically integrated optical circuits.

Candidate is expected to be hands-on and able to operate all process tools required in the assembly of next generation development builds.  Candidate will be assisting Assembly Engineers in running experiments, data collection and analyzing data.
Candidate will work in a team environment consisting of engineers and operators, requiring excellent written and verbal communication skills.  Responsibilities will also include assisting in maintaining operational documents and training new operators.

Responsibilities will include engineering support in sustaining and monitoring performance of  die singulation, die attach, wirebond and inspection tools and/or process steps in the fabrication of monolithically integrated optical circuits.

Familiarity with cleaving singulation, die-attach and wirebond assembly process related defects. Knowledge in identifying or addressing common causes of assembly defects is a plus.  Experience with SPC and MES systems is a plus.
Experience in III-V semiconductors is desired.

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