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Job description
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Texas Instruments is seeking a Process Development Engineering Intern within the DLP® Products MEMS Development group. We work to define and develop the next generation manufacturing processes for Digital Micromirror Devices (DMD) and Micro Electro Mechanical Systems (MEMS). Our team uses standard semiconductor wafer fabrication methods such as photolithography, etch, and thin film deposition for high volume MEMS manufacturing. The process development engineer works closely with design, characterization, and test teams to play a key role in ensuring the yield and reliability of new products.
The role includes activities such as:
- Design of experiments to establish new manufacturing methods and process recipes,
- Use of process characterization tools such as scanning electron microscopy, ellipsometry, atomic force microscopy, and interferometry,
- Identification and characterization of new thin films materials,
- Data analysis for process and test yield improvement,
- Working within the team to drive the necessary actions to meet the yield and reliability needs for the technology.
Minimum requirements:
- Currently pursuing a Bachelor’s degree in areas such as Physics, Materials Science, Electrical Engineering, Chemistry, Optoelectronics or related engineering degree.
- Cumulative 3.0/4.0 GPA or higher
Preferred qualifications:
- Strong background in semiconductor processing and characterization methods
- Basic understanding of operation and fabrication methods for MEMS
- Strong verbal and written communication skills
- Ability to work in teams and collaborate effectively with people in different functions
- Ability to take the initiative and drive for results
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