Project Architect – Backend (ASIC Manufacturing / Semiconductor)

We’re hiring for a full-time opportunity with a leading semiconductor R&D organization in USA. This role focuses on Project Architect – Backend (ASIC Manufacturing / Semiconductor) . Detailed job description is given below. Please share your resume to 

Job Summary

We are seeking an experienced Project Architect to lead technical customer engagements for ASIC/SoC manufacturing projects. The ideal candidate will have deep expertise in ASIC Packaging, Production Test, Qualification, OSAT management, and semiconductor manufacturing, along with strong project management and customer-facing experience.

Key Responsibilities

• Lead technical customer engagements for ASIC/SoC manufacturing projects.
• Define project scope, timelines, costs, risks, and Statements of Work (SOW).
• Provide technical expertise in ASIC Packaging, Production Test, Qualification, and Supply Chain.
• Collaborate with customers, business development, and cross-functional engineering teams.
• Manage multiple projects and support pre-sales activities.

Required Skills

• MSc/PhD in Microelectronics, Electrical Engineering, Physics, or related field.
• 10+ years of experience in ASIC Post-Silicon Manufacturing.
• Strong expertise in:
  • Package Design (FCBGA, WLCSP, QFN, QFP)
  • Advanced Packaging (CoWoS, WoW, CoW)
  • Wafer Sort & Final Test
  • JEDEC Qualification (Automotive & Space)
  • Production Test & Qualification Flows
• Experience working with OSATs, NPI, SOW preparation, and project management.
• Excellent communication and customer-facing skills.