PCB Layout Engineer - Menlo Park (Onsite)

We are looking for a PCB Layout Engineer to join our team. Please review the job description below, and let us know if you are interested and available.

If this opportunity matches your experience and career goals, we would love to discuss it more. Additionally, feel free to share your updated resume for consideration

Role: PCB Layout Engineer

Location: Menlo Park (Onsite)

Duration: Long Term Contract

Contract Type: W2 only

Job Description: 

Must have :        Allegro PCB and CAD Software

Key Responsibilities

• Own end-to-end PCB layout for complex, high-density designs used in data center server boards
• Perform high-speed digital layout for interfaces like HBM,DDR4/5, PCIe Gen 5/6, USB 3.2 or higher, with attention to controlled impedance, length matching, and crosstalk mitigation
• Develop and enforce layout design rules for High-speed digital, analog, mixed-signal, and power domains within tightly constrained wearable form factors
• Collaborate with electrical engineers to review schematics and provide layout-driven feedback on component placement, power distribution network design, and signal routing strategies
• Partner with mechanical engineers to resolve physical constraints including board outline, connector placement, thermal management, and stack-up definition
• Drive design-for-manufacturability reviews with contract manufacturers and PCB fabricators to ensure layouts meet yield and reliability targets
• Maintain and improve PCB design standards, layer stack-up libraries, and footprint libraries to support scalable development across multiple hardware programs
• Support by providing layout documentation, net tracing support, and design revision analysis for prototype and production boards

Skill Requirements

1. Advanced Proficiency In Allegro Pcb For Pcb Layout And Design.
   Strong Knowledge Of Cad Software For 2D And 3D Design Applications.
   10-14 years of CAD experience, Cadence Allegro Layout tool 23.1 and above experience is mandatory
2. Hands on experience in HDI micro via( Blind/Buried) technology 
3. Intel or high complex SoC/Microprocessor/FPGA based PCB design experience preferred
   high complex SoC/Microprocessor/FPGA based PCB design experience preferred
4. Ability to deliver PCB CAD layout of High Density, High Speed memory designs (DDR5/LPDDR5), PCIe Gen 5 or Gen 6, Power Delivery, Mixed Analog/Digital
5. Deep knowledge of CES (Constraint Editor) and high -speed constraint driven designs, DFA/DFM/DFT knowledge to adhere to Quality PCB fabrication and assembly assurance
6. Strong Communication And Presentation Abilities To Effectively Convey Design Concepts.

Thank you!

Best Regards,

Sumit Talekar

Associate Manager – Talent Acquisition

Silverlink Technologies Inc.

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