Principal Metrology Engineer – PIC Wafer Fab

Job Family Description
Direct Production (DP) covers the overall manufacturing operations of Nokia. Contains the direction and monitoring of business' operational processes concerning production, man and machinery performance, and maintenance, as well as related cost controls, quality, and packaging tasks.

Develop, qualify, and maintain metrology recipes for CD-SEM, profilometry, overlay, ellipsometry, and defect inspection tools.

· Own and support metrology equipment performance, qualification, and continuous improvement.

· Develop metrology sampling plans and inline monitoring strategies.

· Analyze process and metrology data to characterize processes and improve process control.

· Monitor SPC charts and investigate process excursions using RCCA methodologies.

· Support wafer-level failure analysis, including FIB, EDX, and coordination of external analyses.

· Troubleshoot process and equipment issues in collaboration with Operations and Engineering teams.

· Create equipment specifications, procedures, and OCAP documentation.

· Train operators and technicians on metrology tools and procedures.

· Support new technology development, process qualifications, technology transfers, and production ramp activities.

Qualifications

· MS in Electrical Engineering, Materials Science, Physics, or a related field.

· 10+ years of semiconductor wafer fabrication experience (7+ preferred).

· Strong problem-solving, data analysis, and communication skills.

· Experience with statistical process control (SPC), failure analysis, and process characterization.

· Hands-on experience with CD-SEM, profilometers, ellipsometers, and defect inspection tools preferred.

· Experience with MES systems is a plus.

· Experience in III-V semiconductor technologies (InP or GaAs) is highly desirable.

· Familiarity with photolithography, etch, deposition, and CVD processes preferred.

Work Schedule

Compressed work week: Monday-Wednesday and every other Thursday, 12-hour day or night shifts.