Advanced Packaging Engineer

Top Mandatory Skills:

• 7+ years of advanced semiconductor packaging experience.
• Hands-on experience with 2.5D & 3D packaging technologies.
• Strong experience with chiplet architectures and heterogeneous integration.
• Experience with multi-die package design, silicon interposers, TSV, and advanced substrate technologies.
• Experience supporting AI/HPC semiconductor products from concept through production.
• Strong knowledge of package assembly, manufacturing, reliability, yield improvement, and qualification.
• Experience working with OSATs and semiconductor foundries.
• Solid understanding of thermal, mechanical, and electrical aspects of package design.
• Bachelor''s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related field.

Preferred Skills:

• Experience with CoWoS, Foveros, EMIB, SoIC, or similar advanced packaging technologies.
• HBM integration experience.
• Experience with Cadence Allegro or Siemens Xpedition Package Designer.
• Experience supporting AI Accelerators, GPU, CPU, or ASIC products.
• Knowledge of SI/PI analysis, JEDEC standards, and package failure analysis.