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Advanced Packaging Engineer

Accroid IncPhoenix, AZ🇺🇸United StatesPosted 22 Jul 2026

Why This Role Stands Out

Advance your career in cutting-edge semiconductor packaging with Accroid Inc., where you'll shape the future of AI and HPC products. This hybrid role is perfect for experienced engineers with a deep understanding of 2.5D/3D technologies, chiplet architectures, and heterogeneous integration, offering significant opportunities for professional growth and impact. Apply today to join a renowned company and contribute to groundbreaking innovations!

Quick Overview

Work Type
Hybrid
Level
Mid Senior

Job Description

Top Mandatory Skills:

  • 7+ years of advanced semiconductor packaging experience.
  • Hands-on experience with 2.5D & 3D packaging technologies.
  • Strong experience with chiplet architectures and heterogeneous integration.
  • Experience with multi-die package design, silicon interposers, TSV, and advanced substrate technologies.
  • Experience supporting AI/HPC semiconductor products from concept through production.
  • Strong knowledge of package assembly, manufacturing, reliability, yield improvement, and qualification.
  • Experience working with OSATs and semiconductor foundries.
  • Solid understanding of thermal, mechanical, and electrical aspects of package design.
  • Bachelor''s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related field.

Preferred Skills:

  • Experience with CoWoS, Foveros, EMIB, SoIC, or similar advanced packaging technologies.
  • HBM integration experience.
  • Experience with Cadence Allegro or Siemens Xpedition Package Designer.
  • Experience supporting AI Accelerators, GPU, CPU, or ASIC products.
  • Knowledge of SI/PI analysis, JEDEC standards, and package failure analysis.

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