Senior Semiconductor Packaging Engineer

🚨 Hiring: Senior Semiconductor Packaging Engineer

📍 Morgan Hill, CA — Onsite
💼 Full-Time | Direct Hire

We are looking for an experienced Semiconductor Packaging Engineer to support the development and manufacturing of advanced semiconductor products. This is a hands-on engineering opportunity for someone with strong experience in die attach, semiconductor packaging, and process/equipment development.

🔧 What You’ll Do

• Develop and improve semiconductor packaging and assembly processes.
• Work on die attach/die bonding processes and equipment.
• Develop process methods, select materials, and identify opportunities to improve manufacturability.
• Work with equipment vendors and internal engineering/manufacturing teams to install, qualify, troubleshoot, and optimize equipment.
• Support new product introduction (NPI) and transition new processes into manufacturing.
• Develop and qualify tooling, equipment, and materials.
• Troubleshoot manufacturing and process issues and identify root causes.
• Perform process optimization, DOE, FMEA, SPC, and other engineering analyses.
• Support reliability testing, failure analysis, and corrective actions.
• Evaluate process risks and implement appropriate mitigation strategies.
• Drive continuous improvements related to quality, yield, reliability, and cost.
• Prepare technical documentation and communicate project status, findings, and recommendations to engineering and management teams.

🎯 What We’re Looking For

• Bachelor’s or Master’s degree in Mechanical Engineering, Materials Engineering, Industrial Engineering, Applied Science, or a related technical field.
• Experience in semiconductor packaging, package development, process development, or semiconductor manufacturing.
• Strong hands-on experience with die attach / die bonding.
• Datacon equipment experience is required, preferably Datacon EVO.
• Experience working with semiconductor assembly or packaging equipment.
• Strong problem-solving and troubleshooting skills.
• Experience with engineering methodologies such as DOE, FMEA/PFMEA, SPC, 8D, Pareto analysis, or control charts is highly desirable.
• Understanding of semiconductor reliability, materials, failure analysis, or qualification processes is a plus.
• RF/RF Power experience is a plus but not required.
• Experience with high-volume manufacturing is preferred.
• Strong communication, documentation, and project coordination skills.

⭐ Important

We are open to candidates who may not have extensive RF Power or assembly-process experience. Strong semiconductor package/process development and die attach experience are more important & Datacon experience is a must.

If you have experience in semiconductor packaging, die attach, Datacon equipment, or package/process development, please reach out or send me your resume.