IC Packaging Design Engineer
Why This Role Stands Out
This hybrid role offers a fantastic opportunity to leverage your expertise in IC packaging design using industry-leading tools like Siemens Xpedition or Cadence Allegro, contributing to cutting-edge projects with significant impact. You'll thrive here if you possess strong skills in physical design, substrate layout, and SI/PI aware implementation, driving innovation and ensuring high performance and manufacturability. Apply now to join a dynamic team and advance your career in a flexible, growth-oriented environment.
Quick Overview
Job Description
IC Packaging Design Engineer
Experience:
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Candidates should have experience in the below domains:
- Physical Design & Layout
- Substrate design and layout
- SI/PI aware design implementation
- Design for performance, manufacturability, yield, and reliability
- Design rule compliance
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