Signal and Power Integrity (SI/PI) Engineer

Role Summary

We are seeking an experienced SI/PI Engineer to join our Advanced Silicon Packaging team. In this role, you will be responsible for signal integrity and power integrity analysis, modeling, and design optimization of next-generation multi-die packaging architectures including 2.5D/3D integration, silicon interposers, and high-bandwidth memory (HBM) interfaces.

Team: Hardware Design Engineering — Advanced Packaging

Required Qualifications

5+ years of experience in SI/PI analysis for semiconductor packaging or high-speed PCB design

Strong proficiency with industry-standard EM and circuit simulation tools:

1. EM Solvers: Ansys HFSS, Ansys SIwave, Cadence Clarity 3D, Keysight ADS Momentum
2. Circuit Simulation: Synopsys HSPICE, Cadence Spectre, Keysight ADS
3. PDN Analysis: Ansys RedHawk, Cadence Voltus, Sigrity PowerDC/PowerSI

Deep understanding of transmission line theory, Maxwell''s equations, and S-parameter analysis

Experience with high-speed interface protocols (PCIe, UCIe, HBM, DDR, Ethernet SerDes)

Proficiency in package stackup design, impedance control, and via transition optimization

Hands-on experience with measurement correlation (VNA, TDR/TDT, near-field scanning)

Programming/scripting skills (Python, MATLAB, Tcl) for automation and post-processing