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PCB Layout Engineer

Recruitment.aiMaynard, MA🇺🇸United StatesPosted Oct 4, 2026

Why this role stands out

This mid-senior role at Recruitment.ai offers you the chance to drive innovation in high-speed optical communication while enjoying the perfect balance of professional autonomy and hybrid flexibility. You will thrive here if you are a detail-oriented expert in Cadence Allegro who enjoys tackling complex, high-density design challenges within a collaborative, world-class engineering team. Take the next step in your career and apply today to make a significant impact on next-generation technology.

Quick overview

SeniorityMid Senior
Work modeHybrid
LocationMaynard, MA, United States
Posted2 weeks ago
PCB Design

Job description

We are looking for an experienced PCB Layout Engineer with a strong, recent hands-on background in complex high-speed and high-density PCB design. The ideal candidate should be comfortable working independently and contributing to advanced optical communication products.

Key Responsibilities

  • Design and develop complex PCB and package substrate layouts for advanced communication products.
  • Work on high-speed, high-density multilayer PCB designs.
  • Ensure PCB layouts comply with IPC standards, internal design practices, and fabrication requirements.
  • Collaborate closely with Electrical, Mechanical, Thermal, Signal Integrity, Power Integrity, and Manufacturing teams.
  • Work directly with PCB fabricators and substrate vendors to resolve DFM and manufacturing issues.
  • Support designs through fabrication, assembly, review, and production release.

Required Qualifications

  • 10+ years of relevant PCB board and/or package substrate layout experience preferred.
  • Strong hands-on expertise with Cadence Allegro PCB Design.
  • Experience designing complex high-speed and high-density multilayer PCBs.
  • Strong experience with HDI PCB design, including technologies such as blind/buried vias, microvias, stacked microvias, or sequential lamination.
  • Experience with fine-pitch BGA layouts and advanced component packages.
  • Strong understanding of controlled impedance and transmission-line routing, including microstrip and stripline.
  • Experience with Signal Integrity (SI) and high-speed routing practices.
  • Strong understanding of PCB fabrication, assembly, DFM, and manufacturing tolerances.
  • Experience working with PCB fabrication and manufacturing vendors.
  • Knowledge of applicable IPC standards.

Preferred / Nice-to-Have Skills

  • Package substrate or complex organic substrate layout experience.
  • mSAP PCB layout experience.
  • Cadence SiP experience.
  • Experience with optical communication or networking hardware.
  • Experience with optical pluggable products such as QSFP-DD, OSFP, or CFP2.
  • Wire Bond component layout experience.
  • Experience laying out high-current multiphase DC-DC power converters for processors or GPUs.
  • Knowledge of IPC Class 2/3 and JEDEC standards.

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